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Video
Video Description
Stock Video ID: 1099203341
Extracted from Semiconductor Wafer Silicon Dies are being Attached to Substrate by Pick and Place Machine. Semiconductor Packaging Process. Computer Chip Manufacturing at Fab.
Important information
Release information: Signed model and property release on file with Shutterstock, Inc.
Video Formats
Frame rate
25fps
Duration
0:09
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Upload date: Jan 20, 2023